Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling
By Tan Hui, Longwen Wu, Mingyang Wang, Zihao Yang, Ping-an Du. International Journal of Heat and Mass Transfer, 2019
179 citations recorded by the source corpus.
Abstract To meet the demand of ever-increasing heat flux of electronic chips, the influence of topology structure of microchannels on its heat transfer performance in chip cooling was investigated in this paper. First, four topologies were designed, including ternate veiny, lateral veiny, snowflake shaped and spider netted. Then fluid-thermal coupling numerical simulations were employed and the results showed that the spider netted microchannel yield the best heat transfer performance among the proposed structures. Furthermore, the geometrical parameters of the spider netted microchannel were optimized. Finally, the straight and spider netted microchannel were made by 3D printing technique and the experiment was conducted. The experimental results indicated that the heat transfer performance of the spider netted microchannel was better than the straight, the difference of the maximum heat source temperature reached 9.9 °C in the heat flux of 100 W/cm2, and get larger and larger with the increase of heat flux. It was concluded that the topology structure of microchannel had a significant impact on its heat transfer performance, especially in high heat flux.
Subfields: Biomedical Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/b5432b5d15d76480657031f14c5ebb24f61395e8
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In Biomedical Engineering
In Mechanical Engineering
Citations in the corpus
- A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “Some biomimetic patterns such as leaf [65], snowflake and spiderweb [66] have been investigated and found to be efficient in heat transfer and temperature uni-formity.”