Diffusion Studies of Copper on Ruthenium Thin Film A Plateable Copper Diffusion Barrier

By R. Chan, T. Arunagiri, Yibin Zhang, O. Chyan, Robert M. Wallace, M. J. Kim, T. Hurd. 2004

157 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/b4e1c679cd94c7088e46a2fca07bb23fc2cb2bad