Thermodynamics and thermal stress analysis of thermoelectric power generator: Influence of pin geometry on device performance

By A. Almerbati, B. Yilbas, Ahmet Z. Sahin. 2013

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A comprehensive review of thermoelectric technology: materials, applications, modelling and performance improvement (2016, methodology): “Moreover, the thermodynamics and thermal stress analysis of TEG is also done to assess the influence of pin geometry on device performance [43].”
A review on thermoelectric renewable energy: Principle parameters that affect their performance (2014, background): “[147] examined the influence of device geometry on thermal stress, thermal efficiency and output power, and the result indicated that the presence of high stress can be attributed to the mismatch of thermal expansion coefficients between the pin and the hot plate, which generates high stress levels ”