Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions

By D. Suh, D. W. Kim, Pilin Liu, Hyunchul Kim, J. Weninger, C. Kumar, Aparna Prasad, B. Grimsley, Hazel B. Tejada. 2007

164 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/b26358cda3fa9eaf597ccf4fa562bdc0ceb8e245