Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

By Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, E. Ide. 2008

137 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/b229b554f8a9d749a04548cf79cb16c92ad087b9