Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
By Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, E. Ide. 2008
137 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/b229b554f8a9d749a04548cf79cb16c92ad087b9