Hierarchical microstructure design to tune the mechanical behavior of an interstitial TRIP-TWIP high-entropy alloy

By J. Su, Dierk Raabe, Zhiming Li. Acta Materialia, 2019

469 citations recorded by the source corpus.

Abstract We demonstrate a novel approach of utilizing a hierarchical microstructure design to improve the mechanical properties of an interstitial carbon doped high-entropy alloy (HEA) by cold rolling and subsequent tempering and annealing. Bimodal microstructures were produced in the tempered specimens consisting of nano-grains (∼50 nm) in the vicinity of shear bands and recovered parent grains (10–35 μm) with pre-existing nano-twins. Upon annealing, partial recrystallization led to trimodal microstructures characterized by small recrystallized grains (

Subfields: Aerospace Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/b05a567fba607a36035e5aacdcb33e4ec03e36b5

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In Aerospace Engineering

  1. Zhiming Li
  2. U. Ramamurty

In Mechanical Engineering

  1. Jun Wei
  2. Zhiming Li
  3. U. Ramamurty

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