Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

By Guo-qing Chang, Fangyuan Sun, Jia-Dong Duan, Zifan Che, Xitao Wang, Jinguo G Wang, Moon J. Kim, Hailong Zhang. Acta Materialia, 2018

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Abstract Cu/Ti bilayers were magnetron sputtered onto a diamond substrate to simulate interfaces in diamond particles reinforced Cu matrix (Cu/diamond) composites. The Cu/Ti/diamond system was tuned to Cu/Ti/TiC/diamond and Cu/TiC/diamond structures by annealing the Ti interlayer at 1073 K. The interfacial thermal conductance (G) between Cu and diamond was experimentally measured by a time-domain thermoreflectance (TDTR) technique to investigate the dependence of the G on the Cu/interlayer/diamond structure. The Cu/TiC/diamond structure exhibits higher G of 76 MW m−2 K−1 than the Cu/Ti/TiC/diamond of 60 MW m−2 K−1, the Cu/Ti/diamond of 30 MW m−2 K−1, the as-deposited Cu/diamond of 66 MW m−2 K−1, and the annealed Cu/diamond of

Subfields: Ceramics and Composites, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/afb6e6ebd1d19f43cb96e1bbc5b240ac6f249275