Fine grinding of silicon wafers: a mathematical model for the chuck shape

By S. Chidambaram, Z. Pei, S. Kassir. 2003

54 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/af8c6eb7c6723fa586b527144e20c03e97960155