The solubility of C in solid Cu

By G. López, E. J. Mittemeijer. 2004

323 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/af41426d5e95ba83830d174ceb68556fd266dbe6

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Francesco Bonaccorso
2. Andrea C. Ferrari
3. C. Backes
4. Xiaodong Zhuang
5. A. Ciesielski
6. Paolo Samorì
7. A. Castellanos-Gómez
8. Xinliang Feng

In Mechanical Engineering

1. Nicola Maria Pugno
2. Jonathan N. Coleman
3. Costas Galiotis
4. K. Papagelis
5. Luigi Pietro Maria Colombo

Citations in the corpus

• Synthesis, growth mechanism and thermal stability of copper nanoparticles encapsulated by multi-layer graphene (2012, background): “In the final stage, the Cu atoms within an individual C/Cu nanoagglomerates coalesces into a Cu nanocore, while the carbon atoms diffuse out onto the surface and form a graphene shell, due to the rapid interdiffusion of Cu and C atoms at the given temperatures and the quite low solubility of C in Cu”
• Production and processing of graphene and related materials (2020, methodology): “The solubility of C in Ni and Co is fairly high in comparison to that of C in Cu [857, 858], and it is much higher than that in Cu [790] ~1 at% (C in Ni) versus 8–10 ppm (C in Cu).”