Ablation and cutting of planar silicon devices using femtosecond laser pulses

By N. Bärsch, K. Körber, A. Ostendorf, K. Tönshoff. 2003

148 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanics of Materials, Ophthalmology

View Paper: https://www.semanticscholar.org/paper/af29188567e983d7668dd4ed44b3a46863dcd1c3

Citations in the corpus

• Ultrafast Laser Applications in Manufacturing Processes: A State-of-the-Art Review (2019, unknown): “(d) Micromachining of various materials : Ultrafast lasers have been used for micromachining of various materials, such as metals [60 – 63], semiconductors [64 – 67], glass [68], organic materials [69], and composite materials [70], as shown in Figs.”
• Progress in ultrafast laser processing and future prospects (2017, unknown): “Such ultrashort pulse widths suppress heat diffusion to the surroundings of processed regions, which significantly reduces the formation of a heat-affected zone (HAZ) and enables ultrahigh precision micro- and nanofabrication of a variety of materials [3, 4].”