Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

By A. El-Daly, A. E. Hammad, A. Fawzy, D. A. Nasrallh. 2013

150 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ae65faac2ef33dedf5293b49f3b39e4aaf89c145