Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

By M. Yim, Y. Li, Kyoung-Sik Moon, K. Paik, Ching-Ping Wong. 2008

148 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/ae34825c37a718b3c6d56e7b5135382a774f24e0