SPICE model of thermoelectric elements including thermal effects
By J. Chávez, J. Ortega, J. Salazar, A. Turó, M. J. García. Proceedings of the 17th IEEE Instrumentation and Measurement Technology Conference [Cat. No. 00CH37066], 2000
139 citations recorded by the source corpus.
Subfields: Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/aa64651c1b8c80de10a3e36b51c8f7138e67adae
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In Materials Chemistry
Citations in the corpus
- Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management (2002, background): “For comparison, a value for chip-wide thermal R and C is also provided for the chip as a whole with heatsink [5].”
- Modeling and Analysis of Thermoelectric Modules (2007, background): “In [3], the authors proposed an equivalent circuit topology for a TEC.”