High-resolution non-destructive three-dimensional imaging of integrated circuits

By M. Holler, M. Guizar‐Sicairos, Esther H. R. Tsai, R. Dinapoli, Elisabeth Müller, Oliver Bunk, J. Raabe, G. Aeppli. Nature, 2017

436 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Radiation, Structural Biology

View Paper: https://www.semanticscholar.org/paper/aa618e6cd2bee89cf733383a36c73859e984df17