Qubit compatible superconducting interconnects
By B. Foxen, J. Mutus, E. Lucero, R. Graff, A. Megrant, Yu Chen, C. Quintana, B. Burkett, J. Kelly, Evan Jeffrey and 20 more. 2017
133 citations recorded by the source corpus.
We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the three dimensional integration of quantum circuits without introducing lossy amorphous dielectrics. They are composed of indium bumps several microns tall separated from an aluminum base layer by titanium nitride which serves as a diffusion barrier. We measure the whole structure to be superconducting (transition temperature of 1.1 K), limited by the aluminum. These interconnects have an average critical current of 26.8 mA, and mechanical shear and thermal cycle testing indicate that these devices are mechanically robust. Our process provides a method that reliably yields superconducting interconnects suitable for use with superconducting qubits.
Subfields: Artificial Intelligence, Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/a90cd7df37640aba1729619101e4defeb2b18064
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In Artificial Intelligence
In Atomic and Molecular Physics, and Optics
In Electrical and Electronic Engineering
Citations in the corpus
- Quantum Electrodynamics in a Topological Waveguide (2020, background): “While the present work was limited to a one-dimensional system, the state-of-the-art technologies in superconducting quantum circuits [64] utilizing flip-chip methods [59,60] will enable integration of qubits into twodimensional metamaterial surfaces.”