Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

By S. Nai, Jun Wei, Manoj Gupta. 2006

149 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/a8c3f372467271d67639f5e1f3359aad768878cb

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. J. Hansson
2. L. Ye
3. Johan Liu
4. T. Nilsson

Citations in the corpus

• Novel nanostructured thermal interface materials: a review (2018, background): “reported with fillers of CNTs [112], graphite [113], Zn [114] and Cu [115] into various solders.”