A renewable resveratrol-based epoxy resin with high Tg, excellent mechanical properties and low flammability

By Yazhou Tian, Qiong Wang, Lijiao Shen, Zhichao Cui, Liangliang Kou, Jue Cheng, Junying Zhang. 2020

182 citations recorded by the source corpus.

Abstract Preparing low-flammable biobased epoxy resins with a high glass transition temperature (Tg) and excellent mechanical properties is significant for the rapid growing electronics and microelectronics industry. In this research, a resveratrol-based epoxy resin (REEP) with well-designed chemical structures possessing trifunctional epoxy groups and rigid conjugate structures was prepared through the one-pot method and was then cured by methyl hexahydrophthalic anhydride (MeHHPA). The conventional petroleum-based epoxy resin (DGEBA) was cured by the same kind of curing agent. Results showed that Tg of REEP/MeHHPA was up to 210.8 °C, much higher than that of DGEBA/MeHHPA (only 146.5 °C). The tensile strength and modulus of REEP/MeHHPA were 73.5 MPa and 3.0 GPa, respectively. More importantly, REEP/MeHHPA exhibited exceptional low permittivity (about 3.5) and low flammability with high char yield of 19.0% (800 °C). Therefore, the resveratrol-based epoxy resin could be a promising candidate for DGEBA and has great potential application in electronics and microelectronics industry.

Subfields: Mechanical Engineering, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/a85d7d32d8aae54e226d4e869ed1d5f89fb32029