Electrically pumped hybrid AlGaInAs-silicon evanescent laser.

By A. Fang, Hyundai Park, O. Cohen, Richard Jones, Mario Paniccia, John E. Bowers. Optics Express, 2006

1,200 citations recorded by the source corpus.

An electrically pumped light source on silicon is a key element needed for photonic integrated circuits on silicon. Here we report an electrically pumped AlGaInAs-silicon evanescent laser architecture where the laser cavity is defined solely by the silicon waveguide and needs no critical alignment to the III-V active material during fabrication via wafer bonding. This laser runs continuous-wave (c.w.) with a threshold of 65 mA, a maximum output power of 1.8 mW with a differential quantum efficiency of 12.7 % and a maximum operating temperature of 40 degrees C. This approach allows for 100's of lasers to be fabricated in one bonding step, making it suitable for high volume, low-cost, integration. By varying the silicon waveguide dimensions and the composition of the III-V layer, this architecture can be extended to fabricate other active devices on silicon such as optical amplifiers, modulators and photo-detectors.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/a7b0a0b03a43e77ddfef6175a25d87e15ccd3c1a

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Citations in the corpus

Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors (2008, background): “The laser sources, as in many off-chip optical communication systems [14], can be located off chip and coupled into the chip using optical fibers or, alternatively, can be bonded to the silicon die, constructing hybridevanescent laser sources [33].”
Integrated germanium optical interconnects on silicon substrates (2014, background): “84 waveguide patterning, (4) Si3N4/SiO2 insulation layer deposition by PECVD and patterning of contact vias by dry and wet etching, and (5) metallization of Al.”
Silicon Photonic Biosensors Using Label-Free Detection (2018, background): “[243,244], and due to it being a 612 cost-effective solution, this work resulted in a startup, Aurrion Inc.”
Roadmapping the next generation of silicon photonics (2023, methodology): “Another commercially successful technique in HVM ( > million/year) [14] has been heterogeneous integration, where multiple materials or epitaxial stacks are processed together into one silicon chip at wafer scale.”