Thermal conductivity enhancement with different fillers for epoxy resin adhesives

By Yuan-Xiang Fu, Zhuo-Xian He, Dong-chuan Mo, Shu-shen Lu. 2014

277 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/a70d3cd720061de3a72b09521304722592ec32b5

How researchers see this paper

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In Materials Chemistry

1. Girish M. Joshi
2. C. Ramesh Kumar
3. M. Vadivelu

Citations in the corpus

• Polymer composites for thermal management: a review (2016, background): “35 times of pure epoxy resin.[36] The larger particle size of”