Backside illuminated SPAD image sensor with 7.83μm pitch in 3D-stacked CMOS technology

By T. Abbas, N. Dutton, Oscar Almer, S. Pellegrini, Y. Henrion, R. Henderson. International Electron Devices Meeting, 2016

137 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Instrumentation, Ophthalmology

View Paper: https://www.semanticscholar.org/paper/a6344a516e7052be789c60e3e73adf107c593e67