Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers

By S. Rossnagel, A. Sherman, F. Turner. 2000

143 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/a5482e1ed5c2a0bd5d59c81f3039939d4c9b68db