Toughening mechanisms of nanoparticle-modified epoxy polymers
By B. B. Johnsen, A. Kinloch, R. Mohammed, A. C. Taylor, S. Sprenger. 2007
929 citations recorded by the source corpus.
An epoxy resin, cured with an anhydride, has been modified by the addition of silica nanoparticles. The particles were introduced via a sole gel technique which gave a very well-dispersed phase of nanosilica particles which were about 20 nm in diameter. Atomic force and electron microscopies showed that the nanoparticles were well-dispersed throughout the epoxy matrix. The glass transition temperature was unchanged by the addition of the nanoparticles, but both the modulus and toughness were increased. The measured modulus was compared to theoretical models, and good agreement was found. The fracture energy increased from 100 J/m 2 for the unmodified epoxy polymer to 460 J/m 2 for the epoxy polymer with 13 vol% of nanosilica. The fracture surfaces were inspected using scanning electron and atomic force microscopies, and the results were compared to various toughening mechanisms proposed in the literature. The toughening mechanisms of crack pinning, crack deflection and immobilised polymer were discounted. The microscopy showed evidence of debonding of the nanoparticles and subsequent plastic void growth. A theoretical model of plastic void growth was used to confirm that this mechanism was indeed most likely to be responsible for the increased toughness that was observed due to the presence of the nanoparticles. 2006 Elsevier Ltd. All rights reserved.
Subfields: Mechanical Engineering, Mechanics of Materials, Polymers and Plastics
View Paper: https://www.semanticscholar.org/paper/a4e3f1afeb0acc22c57f005bf3cee8753cdc6b1a
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In Mechanical Engineering
In Mechanics of Materials
In Polymers and Plastics
Citations in the corpus
- Interlaminar fracture toughness and CAI strength of fibre-reinforced composites with nanoparticles - A review (2013, background): “For nano-particulate materials, such as nanosilica, debonding of the nanosilica and subsequent plastic void growth were most likely to be responsible for the increase in fracture toughness [66].”
- The mechanisms and mechanics of the toughening of epoxy polymers modified with silica nanoparticles (2010, methodology): “In the present work the HalpineTsai and the Nielsen models will be used, as these are considered to be the most applicable for the present systems [45].”
- Effects of particle size, particle/matrix interface adhesion and particle loading on mechanical properties of particulate–polymer composites (2008, background): “It should, however, be noted that recently the plastic void growth model [195] and the 3-D interphase network model [196] were advocated as possible toughening mechanisms for epoxy/nanosilica composites.”
- Mechanical properties of epoxy composites with high contents of nanodiamond (2011, methodology): “% ND samples, which follows the trend based on the Lewis–Nielsen model [40] (Fig.”
- Toughening of Epoxy Nanocomposites: Nano and Hybrid Effects (2016, methodology): “To provide an in-depth understanding of the nanomechanics of toughening mechanisms in silica/epoxy nanocomposites, efforts have been made to correlate the obtained fracture energy results to micromechanical models.(70,72,75,91,104) Hence, the model originally suggested by Huang and Kinloch(105) for ”
- Fracture mechanisms of epoxy-based ternary composites filled with rigid-soft particles (2012, background): “A majority of results were taken from the previous studies [4,10–13,15,16,20–22,25,28–34], where similar particle-filled epoxy composite systems were reported.”
- Design and ageing of adhesives for structural adhesive bonding – A review (2015, methodology): “Recently, Kinloch and Taylor et al.33,34 have explored the effects of the addition of nano silica to epoxy resin system.”
- The effect of carbon nanotubes on the fracture toughness and fatigue performance of a thermosetting epoxy polymer (2011, methodology): “Various types of nanoparticles have been used, including silica nanoparticles [7-8], nanoclays [9-10], carbon nanotubes [11-14] or nanofibres [15], and graphene [16].”