Electro-chemical mechanical polishing of single-crystal SiC using CeO2 slurry

By H. Deng, K. Hosoya, Y. Imanishi, K. Endo, K. Yamamura. 2015

138 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/a35b3cde526005dda8146f3871815172ab03332b

Citations in the corpus

• Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramics (2024, unknown): “In addition, modification-assisted abrasive machining of SiC employing external energy field [217], such as electrochemical modification [218–220] (figure 23(b)), ultraviolet irradiation modification [221] (figure 23(c)) and catalyst assisted modification [222–224], has been conducted to improve…”