Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

By W. H. Li, J. Ye, Sam F. Y. Li. 2001

162 citations recorded by the source corpus.

Subfields: Catalysis, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/a349e877dad2901a7005c357999d292ca65088e8

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. W. Daud
2. K. Loh

In Electronic, Optical and Magnetic Materials

1. W. Daud
2. K. Loh

Citations in the corpus

• Additives in proton exchange membranes for low- and high-temperature fuel cell applications: A review (2019, background): “tolerance level to CO is 10,000 to 30,000 ppm [67,82,83].”