Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology

By Yongli Huang, A. Ergun, E. Hæggström, M. H. Badi, B. Khuri-Yakub. 2003

291 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/a2bd684931ed73524c7a010e0f5ee3db5f2b01dd