Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems

By I. Rangelow. 2003

215 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/a25e80d0cfee45941fe98d441028653da09f5193

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. M. Nikkhah
2. Ali Khademhosseini
3. Faramarz Edalat
4. Sam Manoucheri

In Electrical and Electronic Engineering

1. Ali Khademhosseini

Citations in the corpus

• Engineering microscale topographies to control the cell–substrate interface (2012, background): “On the other hand, dry etching processes, such as deep reactive ion etching (DRIE) and reactive ion etching (RIE) are mainly used to develop anisotropic microstructures with square cross sections and vertical sidewalls [47,48].”