Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

By Hani Alarifi, A. Hu, M. Yavuz, Y. Zhou. 2011

146 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/9f6a45cba5f9d6236e5571692a3f7d86a2595990