High-Density Through Silicon Vias for 3-D LSIs

By M. Koyanagi, T. Fukushima, Tetsu Tanaka. Proceedings of the IEEE, 2009

307 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/9e83e28d1350963d1f909c8ec480c0de7816ed07