Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

By W. Boettinger, C. E. Johnson, L. Bendersky, K. Moon, M. Williams, G. Stafford. 2005

323 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/9e2e6203f7acb18b2a16179a97c6c38782f1d00a

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Aerospace Engineering

1. J. Smetana

In Electrical and Electronic Engineering

1. J. Smetana

In Mechanical Engineering

1. J. Smetana

Citations in the corpus

• Theory of Tin Whisker Growth: “The End Game” (2007, result): “This is contrary to typical columnar matte tin finishes that become compressively stressed over time [22], [38], [39].”