Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers

By Haibo Huang, F. Spaepen. 2000

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The effect of film thickness on the failure strain of polymer-supported metal films (2010, background): “04/09/2009 16:21:17 3 thickness ratios, the net elongation of the freestanding film upon rupture is small, typically less than a few percent [9-13].”
Design and performance of thin metal film interconnects for skin-like electronic circuits (2004, background): “trically conducting much beyond the typical fracture strain of free-standing thin films of 1% to 2% [13], similar to stripes on nonprestretched PDMS substrates [4], [12].”
What is behind the inverse Hall–Petch effect in nanocrystalline materials? (2007, background): “In the context of this discussion, it is valuable to consider the expected behavior of nanocrystalline copper, which has been widely investigated in the open literature [2,4,7,8,46,61–73], According to the model outlined above, copper would be more likely to exhibit an inverse Hall– Petch effect and”