Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

By Shan Chen, F. Ke, Min Zhou, Yi-long Bai. 2007

194 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/99c37d8e384fe0ecea8bf5d66e73826a993bc244