Tailoring stacking fault energy for high ductility and high strength in ultrafine grained Cu and its alloy
By Yonghao Zhao, Yuntian Zhu, Xiaozhou Liao, Z. Horita, Terence G. Langdon. 2006
320 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/97128412acff655033e2a3592238cd5e1f701a87
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Materials Chemistry
- Yuntian Zhu
- R. Valiev
- Terence G. Langdon
- Z. Horita
- I. Ovid’ko
- Yuri Estrin
- Yonghao Zhao
- Michael Zehetbauer
In Mechanical Engineering
- Yuntian Zhu
- R. Valiev
- Terence G. Langdon
- Z. Horita
- I. Ovid’ko
- Yuri Estrin
- Yonghao Zhao
- Michael Zehetbauer
Citations in the corpus
- Microstructural origins of high strength and high ductility in an AlCoCrFeNi2.1 eutectic high-entropy alloy (2017, background): “The planar dislocation glide was frequently reported in low SFE binary alloys, such as Cu-Al [36] and Cu-Zn [37].”
- A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryorolling and intermediate aging treatment (2017, background): “The improved ductility is due to improved dislocation storage capacity and higher rate of strain hardening, which is caused by the formation of profuse twins and stacking faults [37,38].”
- Fundamentals of Superior Properties in Bulk NanoSPD Materials (2016, background): “[5,25] Reported successful strategies include inducing effects that promote the occurrence of a high density of twin boundaries,[12,48,49] lowering the stacking fault energy to activate deformation twinning,[12,14,50] introducing a high density of second-phase nanoparticles,[13,51] or through grain ”