Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

By Kazuhiro Nogita, T. Nishimura. 2008

190 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/95ab405514c75ac10021ef137ce180af21c4411d