Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

By Tzong-Lin Wu, F. Buesink, Flavio G. Canavero. IEEE transactions on electromagnetic compatibility (Print), 2013

227 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/944b8ce5d1c6f9f15df0c6f5fb353a075e41e412