The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

By F. Che, W. Zhu, E. Poh, Xiaowei Zhang, X. R. Zhang. 2010

144 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/93d95827aa301fc386dbaf2a8f1e10b7db68775e