Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

By T. Schubert, Ł. Ciupiński, W. Zieliński, A. Michalski, T. Weissgärber, B. Kieback. 2008

282 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/93616db81538f60f171aa63b79927228c47306ce

How researchers see this paper

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In Mechanical Engineering

1. S. Kidalov
2. F. M. Shakhov

Citations in the corpus

• Thermal Conductivity of Diamond Composites (2009, methodology): “added to the melt to form a structure of the type filler - barrier layer - binder [5].”