Creep deformation characteristics of tin and tin-based electronic solder alloys

By M. D. Mathew, H. Yang, S. Movva, K. Murty. 2005

178 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/93588f190d205ce9286d802aefba4f4b7205af98