An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses

By G. Galyon, L. Palmer. IEEE transactions on electronics packaging manufacturing (Print), 2005

138 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/934d593d5564a6c8b85a5d527af0e8b1612077ff

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In Aerospace Engineering

1. J. Smetana

In Electrical and Electronic Engineering

1. J. Smetana

In Materials Chemistry

1. J. Smetana

Citations in the corpus

• Theory of Tin Whisker Growth: “The End Game” (2007, background): “Since Cu diffuses into Sn and the resulting molar volume of the intermetallic is greater than the Sn that it displaces, it results in a compressive stress on the tin film [25].”