Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures
By R. Ranjan, Jayathi Y. Murthy, Suresh V. Garimella. 2009
162 citations recorded by the source corpus.
Subfields: Computational Mechanics, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/92596c864b17294d6399f9b1afff363112e6f46a
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In Computational Mechanics
In Mechanical Engineering
Citations in the corpus
- Characterization of evaporation and boiling from sintered powder wicks fed by capillary action (2010, background): “The dominance of the wick thermal conduction resistance has been highlighted in the modeling of thinfilm evaporation from porous media [6,7].”
- A review of small heat pipes for electronics (2016, methodology): “[84, 85] developed a model to calculate the evaporating liquid meniscus in wick microstructures under saturated vapour conditions.”
- Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices (2013, background): “Only pure conduction is considered in the heat transfer model as a previous study suggested that the internal convection has relatively small effects [14,15].”