Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices

By Milan Visaria, I. Mudawar. IEEE transactions on components and packaging technologies, 2008

136 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/9223b731e39e57859d011e70d0957774858b646e

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Computational Mechanics

1. Gangtao Liang
2. I. Mudawar
3. Sung-Min Kim
4. Suresh V. Garimella
5. Wei Qu
6. Jaeseon Lee
7. Yoav Peles
8. Satish G. Kandlikar

In Mechanical Engineering

1. Gangtao Liang
2. I. Mudawar
3. Sung-Min Kim
4. Satish G. Kandlikar
5. Wei Qu
6. Suresh V. Garimella
7. Jaeseon Lee
8. Yoav Peles

Citations in the corpus

• Review of pool boiling enhancement with additives and nanofluids (2018, background): “Boiling processes can be implemented in a variety of schemes [4], including pool boiling [5,6], macro/mini/micro-channel flow boiling [7], jet-impingement [8], and spray [9,10], as well as hybrid configurations combing two or more of these schemes [11].”
• Review of spray cooling – Part 1: Single-phase and nucleate boiling regimes, and critical heat flux (2017, unknown): “24 3 5; ð70Þ which is valid for low rates in the range of 30–50 l/min and a fixed nozzle-to-surface distance of 250 mm. Visaria and Mudawar [109] examined the influences of subcooling on spray performance and CHF.”