GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINT

By P. Tu, Yan Cheong Chan, K. Hung, J. Lai. 2001

134 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/904f37b70ce35193a04cc7fc4f5e3b56b1f91901