Printed circuit board recycling: a state-of-the-art survey

By Jianzhi Li, P. Shrivastava, Zong Gao, Hongchao Zhang. IEEE transactions on electronics packaging manufacturing (Print), 2002

232 citations recorded by the source corpus.

Subfields: Industrial and Manufacturing Engineering

View Paper: https://www.semanticscholar.org/paper/8b60f08084b45545ebb77783864d3862626cad9f

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In Industrial and Manufacturing Engineering

1. Mehmet Ali Ilgin
2. Surendra Mohan Gupta

Citations in the corpus

• A multi-objective fuzzy graph approach for modular formulation considering end-of-life issues (2008, methodology): “…and Alting 1992, Wittenberg 1992, Jovane et al. 1993, Keoleian and Menerey 1994, Lambert 1997, Tsai and Zhang 2000, Shivakumar and Venkat 2001, Li et al. 2004, Zhang et al. 2004) have focused on product design with an aim of ease of disassembly and thus improving the recyclability of…”