Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions
By Dongjo Kim, Sunho Jeong, B. Park, Jooho Moon. 2006
323 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/88499b07a8e1b8cb28957377a3cdde251647d4c3
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In Electrical and Electronic Engineering
- J. Steinke
- Shlomo Magdassi
- A. Kamyshny
- Marc P. Y. Desmulliez
- Soojin Park
- Gerard Cummins
- David Hui
- Kyong Yop Rhee
Citations in the corpus
- Inkjet printing of conductive materials: a review (2012, methodology): “, 2000), using a solvent with a high boiling temperature and low surface tension (Kim et al., 2006) or reformulating the ink to use both a high boiling point and low boiling point solvent (de Gans and Schubert, 2004; Park and Moon, 2006; Shin et al.”
- Synthesis of silver nano particles and fabrication of aqueous Ag inks for inkjet printing (2011, unknown): “The printing of metal inks, especially those containing silver nanoparticles, has been found to be a very powerful tool for direct patterning of electrically conductive interconnects in electronic devices [7-9].”
- A Review of Conductive Metal Nanomaterials as Conductive, Transparent, and Flexible Coatings, Thin Films, and Conductive Fillers: Different Deposition Methods and Applications (2018, background): “Choosing a carrier solution with a high boiling point and low surface tension for Ag NPs (such as ethylene glycol) improves the quality of the printed film and its conductivity (Figure 5) [14].”
- Metal-based Inkjet Inks for Printed Electronics (2011, background): “However, the most often used vehicles are mixtures of various solvents such as water/alcohols [155], water/glycols [105, 146, 155, 156], and multicomponent mixtures containing water, oxygenated organic solvents, and glycerol [112, 143, 146, 155, 157].”