Effect of process parameters on bond formation during ultrasonic consolidation of aluminum alloy 3003

By G. Ram, Yan Yang, B. Stucker. 2006

155 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/86ef61dafc73d651818491f11d568731e53f0511