Optimization study of stacked micro-channel heat sinks for micro-electronic cooling
By Xiaojin Wei, Yogendra K. Joshi. ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2002
183 citations recorded by the source corpus.
Subfields: Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/864c580326454ba046d0de41be17d743614c2cbe
How researchers see this paper
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In Mechanical Engineering
- Stephen U. S. Choi
- S. Jang
- Wei‐Mon Yan
- Tian-Hu Wang
- C. Leng
- Xiao-dong Wang
- Ali J. Chamkha
- E. Abu‐Nada
Citations in the corpus
- 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling (2010, methodology): “For the simulation of forced convective liquid cooling there are a number of empirical correlation-based methods available in the literature [10, 11, 12 , 13, 14, 4]. All these methods are meant only for steady state simulations and are not specifically suitable for microchannel cooling.”
- Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink (2015, methodology): “Following Vafai and Zhu’s work, extensive studies focused on the DL-MCHS were conducted [22–37], which further justified the results indicated by Vafai and Zhu [22–24], demonstrated that the channel number [25,26], aspect ratios of the top and bottom channels [25–29], channel-to-pitch width ratio [2”
- Cooling performance of a microchannel heat sink with nanofluids (2006, background): “Many ideas for improving cooling technology for electronic equipment with high heat generation have been proposed, but can be put into two approaches [1–5].”