Flexible Electronics: The Next Ubiquitous Platform
By Arokia Nathan, A. Ahnood, M. Cole, Sungsik Lee, Yuji Suzuki, P. Hiralal, Francesco Bonaccorso, Tawfique Hasan, Luis Garcia-Gancedo, A. Dyadyusha and 11 more. Proceedings of the IEEE, 2012
838 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/8543f4ba5299930d64eb5605be0cb42d3543df15
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In Biomedical Engineering
- Leandro Lorenzelli
- Ravinder S. Dahiya
- Jiankang He
- Bing Zhang
- Saleem Khan
- Mao Mao
- Riku Jäntti
- Hüseyin Yigitler
In Electrical and Electronic Engineering
- Ravinder S. Dahiya
- Jiankang He
- Bing Zhang
- Saleem Khan
- Mao Mao
- Riku Jäntti
- Hüseyin Yigitler
- Kalle Ruttik
Citations in the corpus
- Extended PDMS stiffness range for flexible systems (2015, neutral): “…polymeric organosilicon compounds - such as polydimethyl-siloxane (PDMS) - have found applications in areas such as flexible electronics [2, 3, 4, 5, 6], moulding and soft lithography [7, 8, 9, 10, 11, 12, 13, 14], microelectromechanical systems (MEMS) [15, 16, 17], self-healing materials [18],…”
- The Emerging Frontiers and Applications of High-Resolution 3D Printing (2017, background): “Flexible electronics, representing a trending format of electronics, has been demonstrating their great potentials in areas such as information technology and medicine [78].”
- A Review on Printed Electronics: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts (2021, background): “PET is the most popular polymer substrate, it has high optical transparency, flexibility, solvent resistance, low price and dimensional stability in high temperatures [37].”
- Flexible Tactile Sensors Using Screen-Printed P(VDF-TrFE) and MWCNT/PDMS Composites (2015, background): “The rapid growth of the field is in line with the electronics roadmap, which indicates the merge of the well-established microelectronics technology with the age-old printing tools to realize electronic systems with simplified processing steps, reduced materials wastage, high throughput, low fabrica”