Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

By Pradeep Lall, D. Panchagade, Y. Liu, W. Johnson, J. Suhling. IEEE transactions on components and packaging technologies, 2004

139 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/84db34b6aaa3a6e76c311f0d882d20e7881cb26c