Creep behavior of eutectic Sn-Cu lead-free solder alloy

By Chi Man Wu, Mingliang L. Huang. 2002

158 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/849d93892934bba69f1e2a1c1baf06d15470639b