Cooling of high-power-density microdevices using liquid metal coolants

By A. Miner, U. Ghoshal. 2004

183 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/847790fffd43d6a743ea36fb7d94309ee129abfe

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Guoqi Zhang
2. Tianling Ren
3. Xuejun Fan
4. Xianping Chen
5. Huaiyu Ye

Citations in the corpus

• A review of small heat pipes for electronics (2016, background): “[135] reported the cooling of high-power-density micro devices with pumps using liquid metal coolants such as Hg, Ga(68)In(20)Sn(12), Na(27)K(78) and SnPbInBi.”