High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa
By B. Agostini, John Richard Thome, Matteo Fabbri, Bruno Michel, Daniele Calmi, U. Kloter. 2008
195 citations recorded by the source corpus.
Subfields: Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/834a59cf174c62f9902f9e5e234931d9d8c4cbea
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
- Abhijit Mukherjee
- Zachary Edel
- A. Gomez
- Satish G. Kandlikar
- Weiwei Deng
- Gangtao Liang
- I. Mudawar
- Ping Cheng
Citations in the corpus
- Universal approach to predicting saturated flow boiling heat transfer in mini/micro-channels - Part II. Two-phase heat transfer coefficient (2013, unknown): “[ 42 ] R m u lt i, H Si li co n + Le xa n”
- Electrospray cooling for microelectronics (2011, background): “The coolant can take the form of impinging jets [1–3] or sprays [4,5].”
- Numerical study of bubble growth and wall heat transfer during flow boiling in a microchannel (2011, background): “[6–8] studied high heat flux flow boiling of refrigerants in microchannel heat sinks in a three-part paper.”